Application of digital PGA technology to K-band microcircuit and microwave subsystem packages

Author

Liang, Hongwei ; Barnes, Heidi Langeberg ; Laskar, Joy ; Estreich, Don

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

48

Issue

12

fYear

2000

fDate

12/1/2000 12:00:00 AM

Firstpage

2644

Lastpage

2651

Abstract

We present for the first time a low-cost high-performance pin grid array (PGA) packaging technology for K-band microcircuit and microwave subsystem packaging. The first-generation package demonstrates a 20 dB return loss to 8 GHz, and the second-generation package improves the return loss to 25 dB from DC to 26.5 GHz. We apply a comprehensive analysis method, which facilitates the optimization of the radio-frequency transition into the package. It combines the time-domain reflectometry analysis and frequency-domain full-wave analysis and reduces the optimization time significantly. The theoretical analysis is verified with measurement in both frequency and time domains. The results demonstrate that the low-cost PGA can be a much more cost-effective microwave packaging solution than the traditional deep cavity metal packages

Keywords

circuit optimisation; hybrid integrated circuits; integrated circuit interconnections; integrated circuit packaging; losses; microwave integrated circuits; multichip modules; 0 to 26.5 GHz; 20 dB; 25 dB; K-band microcircuit packages; K-band microwave subsystem package; RF transition optimisation; digital PGA technology; first-generation package; frequency-domain full-wave analysis; low-cost PGA packaging technology; pin grid array packaging; return loss; second-generation package; time-domain reflectometry analysis; Electronics packaging; Frequency domain analysis; Frequency measurement; K-band; Microwave antenna arrays; Microwave technology; Optimization methods; Radio frequency; Reflectometry; Time domain analysis;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.899025

Filename

899025