DocumentCode :
1431717
Title :
Electrostatic discharge in semiconductor devices: protection techniques
Author :
Vinson, James E. ; Liou, J.J.
Author_Institution :
Intersil Corp., Melbourne, FL, USA
Volume :
88
Issue :
12
fYear :
2000
Firstpage :
1878
Lastpage :
1902
Abstract :
Electrostatic discharges (ESDs) are everywhere-in our homes and businesses. Even the manufacturers of the electronics experience ESD failures in their factories. Electronic devices are sensitive to ESD. ESD results in failure of our computers, calculators, and car phones. There are ways to protect these sensitive components. This paper looks at ESD protection from a two-pronged approach: reducing the likelihood of having an ESD event and improving the robustness of the devices themselves. The first approach focuses on reducing the amount of charge that is developed and controlling the redistribution of any charges that are developed The second approach reviews ways to improve the circuit robustness by improving individual circuit elements and by adding additional elements for charge flow control and voltage clamping.
Keywords :
electrostatic discharge; environmental engineering; integrated circuit reliability; monolithic integrated circuits; overvoltage protection; protection; reviews; semiconductor device reliability; EOS; ESD failures; ESD protection; ESD safe packaging; air ionizers; charge flow control; charge redistribution; charge reduction techniques; circuit robustness; damage limitation; electrical overstress; electrostatic discharge; parts storage; protection techniques; semiconductor devices; transient clamps; voltage clamping; Calculators; Circuits; Electrostatic discharge; Production facilities; Protection; Robust control; Robustness; Semiconductor device manufacture; Semiconductor devices; Voltage control;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/5.899057
Filename :
899057
Link To Document :
بازگشت