Corrosion behaviour of nanostructured copper thin films in comparison with copper sheet in drinking water

Copper thin films were deposited on glass at 70 and 150°C substrate temperature using electron beam-physical vapour deposition technique. The morphology of the deposited film was investigated by scanning electron microscopy. Corrosion behaviour of these films was studied by potentiodynamic polarisation and electrochemical impedance spectroscopy methods. Results showed the corrosion resistance of copper deposits was higher than the copper sheet in water. The higher corrosion resistance of copper deposits is described by the formation of protective CuO, while the main corrosion product of copper sheet in water is malachite, which is not a protective morphology.