DocumentCode :
1434045
Title :
Coplanar Waveguides on High-Resistivity Silicon Substrates With Attenuation Constant Lower Than 1 dB/mm for Microwave and Millimeter-Wave Bands
Author :
Makita, Takehiko ; Tamai, Isao ; Seki, Shohei
Author_Institution :
Oki Electr. Ind. Co., Ltd., Tokyo, Japan
Volume :
58
Issue :
3
fYear :
2011
fDate :
3/1/2011 12:00:00 AM
Firstpage :
709
Lastpage :
715
Abstract :
Coplanar waveguides (CPWs) with extremely low loss have been successfully developed on high-resistivity silicon (HR-Si) substrates as interposers of multichip modules for microwave and millimeter-wave bands. The attenuation constant of these CPWs on HR-Si is less than 1 dB/mm for frequencies up to 100 GHz, which is comparable with that of CPWs on semi-insulating compound semiconductor substrates. Conventional CPW structures show a larger attenuation constant due to the effects of the low-resistivity layer generated at the interface between the insulating layer of SiN and the HR-Si substrate, which has been detected through both experimental investigations and numerical calculations. A CPW structure that suppresses the effects of the low-resistivity layer is presented in this paper. The fabrication process is rather simple and can be smoothly integrated in conventional semiconductor device fabrication processes.
Keywords :
MMIC; coplanar waveguides; electrical resistivity; electromagnetic wave scattering; elemental semiconductors; multichip modules; CPW structures; HR-Si substrate; attenuation constant; coplanar waveguide; fabrication process; high-resistivity silicon substrate; interposer; low-resistivity layer; microwave band; millimeter-wave band; multichip module; semiconductor device fabrication; semiinsulating compound semiconductor substrate; Attenuation constant; coplanar waveguides (CPWs); equivalent circuit calculation; high-resistivity silicon substrate; low-resistivity layer; transmission line theory;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2010.2098878
Filename :
5699916
Link To Document :
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