• DocumentCode
    1434201
  • Title

    A theoretical analysis of quantum-wire fabrication by vacancy-enhanced interdiffusion of quantum wells

  • Author

    Chan, K.S. ; Wong, Y.H. ; Pun, Edwin Y B ; Ho, H.P. ; Chung, Po S.

  • Author_Institution
    Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
  • Volume
    4
  • Issue
    4
  • fYear
    1998
  • Firstpage
    701
  • Lastpage
    705
  • Abstract
    The fabrication of quantum-wire structures using vacancy enhanced interdiffusion of quantum wells is analyzed theoretically. A phenomenological equation is used to describe the effects of strain on vacancy diffusion. The quantum-wire confinement potentials are studied as a function of the trench opening widths and the separation distances from the SiO2-AlGaAs interface. The lateral confinement energy is not a monotonic function of the trench opening width. It first increases and then decreases when the trench opening width is decreased. When the separation distance of the quantum wire from the interface is reduced, the confinement potential is changed from a nonsquare profile to a square-well profile
  • Keywords
    chemical interdiffusion; diffusion; optical fabrication; semiconductor device models; semiconductor quantum wells; semiconductor technology; SiO2-AlGaAs; SiO2-AlGaAs interface; confinement potential; lateral confinement energy; monotonic function; nonsquare profile; phenomenological equation; quantum wells; quantum-wire confinement potentials; quantum-wire fabrication; quantum-wire structures; separation distance; separation distances; square-well profile; strain; theoretical analysis; trench opening widths; vacancy diffusion; vacancy enhanced interdiffusion; vacancy-enhanced interdiffusion; Capacitive sensors; Carrier confinement; Equations; Fabrication; Microelectronics; Optoelectronic devices; Photonics; Potential well; Quantum mechanics; Strain control;
  • fLanguage
    English
  • Journal_Title
    Selected Topics in Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    1077-260X
  • Type

    jour

  • DOI
    10.1109/2944.720482
  • Filename
    720482