Title :
Modeling the substrate effect in interconnect line characteristics of high-speed VLSI circuits
Author :
Wee, Jae-Kyung ; Park, Young-June ; Min, Hong-Shick ; Cho, Dae-Hyung ; Seung, Man-Ho ; Park, Hun-Sup
Author_Institution :
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
fDate :
10/1/1998 12:00:00 AM
Abstract :
A new analytic model for interconnect characteristics is proposed. The model includes the frequency-dependent distribution of the current on the interconnect lines and the substrate as the current path. The validity of the proposed model has been checked by a comparison with the measurement data and the numerical simulation. Through this work, it is found that the substrate return path must be considered for the accurate prediction of the high-frequency characteristics of interconnects
Keywords :
VLSI; current distribution; integrated circuit interconnections; integrated circuit modelling; substrates; analytic model; current distribution; high frequency characteristics; high speed VLSI circuit; interconnect line; substrate effect; Analytical models; Frequency; Impedance; Inductance; Integrated circuit interconnections; Laboratories; Numerical simulation; Signal analysis; Silicon; Very large scale integration;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on