• DocumentCode
    1435159
  • Title

    Design and Characterization of Thin-Film System for Microsensors Embedding in Ti6Al4V Alloys

  • Author

    Zhang, Xugang ; Li, Xiaochun

  • Author_Institution
    Johnson Controls-Saft Adv. Power Solutions, Milwaukee, WI, USA
  • Volume
    10
  • Issue
    4
  • fYear
    2010
  • fDate
    4/1/2010 12:00:00 AM
  • Firstpage
    839
  • Lastpage
    846
  • Abstract
    Reliable structures and systems are critical for numerous engineering applications. These systems are generally operated in harsh environments. Effective monitoring and diagnosis of these structures are of critical importance. To achieve this goal, thin-film micro/nano sensors can be embedded in metal structures to protect them from external harsh environments while providing measurements with desired special and temporal resolutions and accuracy, which cannot be achieved with traditional sensors. Targeting on new sensor applications in harsh environments, this paper presents experimental results on the design and characterization of a thin-film system, including diffusion barrier and insulation layers, for a successful sensor embedding in Ti6Al4V alloy through diffusion bonding. Based on the developed material system, an effective fabrication process of the Ti6Al4V-embedded thin-film PdCr strain gages was developed. The embedded sensors were validated by a functionality test and material characterization.
  • Keywords
    aluminium alloys; microsensors; nanosensors; thin film sensors; titanium alloys; vanadium alloys; diffusion barrier; diffusion bonding; harsh environments; insulation layers; microsensors; thin-film micro-nano sensors; thin-film system; Diffusion bonding; Insulation; Microsensors; Monitoring; Protection; Reliability engineering; Sensor phenomena and characterization; Sensor systems and applications; Thin film sensors; Transistors; Diffusion bonding; embedded microsensors; harsh environments; thin-film strain gages;
  • fLanguage
    English
  • Journal_Title
    Sensors Journal, IEEE
  • Publisher
    ieee
  • ISSN
    1530-437X
  • Type

    jour

  • DOI
    10.1109/JSEN.2009.2035369
  • Filename
    5427263