• DocumentCode
    1436470
  • Title

    A new model for step-stress testing

  • Author

    Khamis, Imad H. ; Higgins, James J.

  • Author_Institution
    Dept. of Stat., Kansas State Univ., Manhattan, KS, USA
  • Volume
    47
  • Issue
    2
  • fYear
    1998
  • fDate
    6/1/1998 12:00:00 AM
  • Firstpage
    131
  • Lastpage
    134
  • Abstract
    The mathematical intractability of the Weibull cumulative exposure model (CE-M) has impeded the development of statistical procedures for step-stress accelerated life tests. Our new model (KH-M) is based on a time transformation of the exponential CE-M. The time-transformation enables the reliability engineer to use known results for multiple-step, multiple-stress models that have been developed for the exponential step-stress model. KH-M has a realistically appealing proportional-hazard property. It is as flexible as the Weibull CE-M for fitting data, but its mathematical form makes it easier to obtain parameter estimates and standard deviations. Maximum likelihood estimates are given for test plans with unknown shape parameter. The mathematical similarity to the constant-stress Weibull model is shown. Chi-square goodness of fit tests are performed on simulated data to compare the fit of the models
  • Keywords
    Weibull distribution; exponential distribution; life testing; maximum likelihood estimation; parameter estimation; reliability theory; Chi-square goodness; Weibull cumulative exposure model; accelerated life tests; exponential cumulative exposure model; fit tests; maximum likelihood estimates; multiple-step models; parameter estimates; proportional-hazard property; reliability; standard deviations; statistical procedures development; step-stress testing; time transformation; Fitting; Impedance; Life estimation; Life testing; Mathematical model; Maximum likelihood estimation; Parameter estimation; Performance evaluation; Reliability engineering; Shape;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/24.722275
  • Filename
    722275