DocumentCode
1436902
Title
Transfer of structured and patterned thin silicon films using the Smart-Cut(R) process
Author
Aspar, B. ; Bruel, M. ; Zussy, M. ; Cartier, A.M.
Author_Institution
CEA, Centre d´´Etudes Nucleaires de Grenoble, France
Volume
32
Issue
21
fYear
1996
fDate
10/10/1996 12:00:00 AM
Firstpage
1985
Lastpage
1986
Abstract
The feasibility of transferring patterned and multilayered thin films, simulating part of the stacked structure of a CMOS integrated circuit, from their original bulk silicon substrate to a final substrate, was demonstrated using the Smart-Cut process
Keywords
CMOS integrated circuits; elemental semiconductors; integrated circuit technology; semiconductor thin films; silicon; silicon-on-insulator; thin film transistors; CMOS integrated circuit; SOI; Si; Smart-Cut process; multilayered thin films; patterned thin Si films; stacked structure; thin film transfer technique;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19961305
Filename
542882
Link To Document