• DocumentCode
    1436902
  • Title

    Transfer of structured and patterned thin silicon films using the Smart-Cut(R) process

  • Author

    Aspar, B. ; Bruel, M. ; Zussy, M. ; Cartier, A.M.

  • Author_Institution
    CEA, Centre d´´Etudes Nucleaires de Grenoble, France
  • Volume
    32
  • Issue
    21
  • fYear
    1996
  • fDate
    10/10/1996 12:00:00 AM
  • Firstpage
    1985
  • Lastpage
    1986
  • Abstract
    The feasibility of transferring patterned and multilayered thin films, simulating part of the stacked structure of a CMOS integrated circuit, from their original bulk silicon substrate to a final substrate, was demonstrated using the Smart-Cut process
  • Keywords
    CMOS integrated circuits; elemental semiconductors; integrated circuit technology; semiconductor thin films; silicon; silicon-on-insulator; thin film transistors; CMOS integrated circuit; SOI; Si; Smart-Cut process; multilayered thin films; patterned thin Si films; stacked structure; thin film transfer technique;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19961305
  • Filename
    542882