DocumentCode
1437307
Title
Quench, thermal, and magnetic analysis computer code for superconducting solenoids
Author
Eyssa, Y.M. ; Markiewicz, W.D. ; Miller, J.
Author_Institution
Nat. High Magn. Field Lab., Florida State Univ., Tallahassee, FL, USA
Volume
7
Issue
2
fYear
1997
fDate
6/1/1997 12:00:00 AM
Firstpage
159
Lastpage
162
Abstract
An update report on the National High Magnetic Field Laboratory (NHMFL) magnet analysis code is presented. Among the recent improvements to the code is the ability to address complex conductors, windings and reinforcements in terms of thermal and magnetic diffusion. In this article we present several examples showing the capabilities of this code. For example copper/stainless steel, Cu/SS wires that are used in pulse magnets as an alternative to other conductors such as CuAg or CuNb have shown to have excellent thermal and mechanical properties. It was found that the rule of mixtures holds in predicting their properties. As a result it is expected that wires that have 10%Cu and 90%SS will essentially keep the SS high modulus and strength. However the 10% copper will improve the conductivity of this reinforcement that it can act as quench-back circuit in case of a quench. In this study we simulated a quench of a high field (20 T) magnet system and varied the Cu/SS ratio. The modeling results show that 5%Cu is enough to make the reinforcement act as quench-back circuit.
Keywords
solenoids; superconducting coils; superconducting magnets; thermal analysis; 20 T; complex conductor; computer code; conductivity; copper/stainless steel wire; high field magnet; magnetic analysis; magnetic diffusion; mechanical properties; modulus; pulse magnet; quench simulation; quench-back circuit; reinforcement; rule of mixtures; strength; superconducting solenoid; thermal analysis; thermal diffusion; thermal properties; winding; Circuits; Conductors; Copper; Laboratories; Magnetic analysis; Magnetic fields; Steel; Thermal conductivity; Thermal quenching; Wires;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/77.614453
Filename
614453
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