Title : 
p-channel LDMOS transistor using new tapered field oxidation technology
         
        
            Author : 
Kim, Jung-Ho ; Kim, J. ; Koo, J.G. ; Kim, D.Y.
         
        
            Author_Institution : 
Micro-Electron. Lab. Technol., Electron. & Telecommun. Res. Inst., Taejeon, South Korea
         
        
        
        
        
            fDate : 
9/17/1998 12:00:00 AM
         
        
        
        
            Abstract : 
The on-resistance of p-channel RESURF (reduced surface field) LDMOS (lateral double-diffused MOS) transistors has been improved by using a new tapered TEOS field oxide in the drift region of the devices. With similar breakdown voltage, at Vgs=-5.0 V, the specific on-resistance of the LDMOS with tapered field oxide is ~31.5 mΩ·cm2, while that of the LDMOS with conventional field oxide is ~57 mΩ·cm2
         
        
            Keywords : 
electric breakdown; integrated circuit technology; oxidation; power MOSFET; power integrated circuits; silicon-on-insulator; -5 V; MOS transistors; RESURF type; SOI LDMOS device; breakdown voltage; drift region; lateral double-diffused MOSFET; p-channel LDMOS transistor; reduced surface field; tapered TEOS field oxide; tapered field oxidation technology;
         
        
        
            Journal_Title : 
Electronics Letters
         
        
        
        
        
            DOI : 
10.1049/el:19981303