DocumentCode :
1437387
Title :
Three-dimensional numerical analysis of the stability of Ag/Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub x/ tape conductors
Author :
Burkhardt, E.E. ; Schwartsz, J.
Author_Institution :
Nat. High Magn. Field Lab., Florida State Univ., Tallahassee, FL, USA
Volume :
7
Issue :
2
fYear :
1997
fDate :
6/1/1997 12:00:00 AM
Firstpage :
199
Lastpage :
202
Abstract :
As the properties of high-T/sub c/ superconducting tapes improve, practical design considerations require more detailed analysis. Here we report investigations of the stability of high-T/sub c/ superconducting tapes. As a result of the broad range of temperature during a transition and the strong temperature dependence and anisotropy of the material properties, the finite element method (FEM) is used to solve the three-dimensional heat conduction equation. The heat source is determined using the operating current, the resistivity of the materials and the critical current density of Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub x/ (BSCCO). The minimum quench energy for several sources is determined for both infinitely long and planar uniform sources in the BSCCO and the two cases are compared.
Keywords :
bismuth compounds; calcium compounds; finite element analysis; heat conduction; high-temperature superconductors; silver; strontium compounds; superconducting tapes; Ag-Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O; Ag/Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub x/ tape conductor; BSCCO; finite element method; heat conduction; high-T/sub c/ superconductor; minimum quench energy; stability; three-dimensional numerical analysis; Anisotropic magnetoresistance; Bismuth compounds; Material properties; Numerical analysis; Numerical stability; Stability analysis; Superconducting films; Superconducting transition temperature; Temperature dependence; Temperature distribution;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.614465
Filename :
614465
Link To Document :
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