DocumentCode :
1437427
Title :
18th International symposium on the physical and failure analysis of integrated circuit
Volume :
10
Issue :
4
fYear :
2010
Firstpage :
494
Lastpage :
494
Abstract :
"Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers."
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2010.2102381
Filename :
5703177
Link To Document :
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