Introduction to the Extreme Environment Technology and Reliability Special Issue

The five invited papers in this special issue cover some of the emerging topics in the present development and investigation of technologies and their reliability for applications under extreme environments. The first three papers focus on SiC, GaN, and SiGe technologies, respectively, followed by the fourth paper on microelectronics packaging reliability for high-temperature applications and the final paper on microelectronics and optoelectronics reliability for space applications.