Title :
Dual Grid Array Antennas in a Thin-Profile Package for Flip-Chip Interconnection to Highly Integrated 60-GHz Radios
Author :
Zhang, Y.P. ; Sun, M. ; Liu, Duixian ; Lu, Yilong
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
fDate :
4/1/2011 12:00:00 AM
Abstract :
We examine the current development of highly integrated 60-GHz radios with an interest in antenna-circuit interfaces. We design and analyze grid array antennas with special attention to the differential feeding and the patterned ground plane. More importantly, we integrate two grid array antennas in a package; propose the way of assembling it to the system printed circuit board; and demonstrate a total solution of low cost and thin profile to highly integrated 60-GHz radios. We show that the package in low temperature cofired ceramic (LTCC) technology measures only 13×13×0.575 mm3 ; can carry a 60-GHz radio die of current and future sizes with flip-chip bonding; and achieves good antenna performance in the 60-GHz band with maximum gain of 13.5 and 14.5 dBi for the single-ended and differential antennas, respectively.
Keywords :
MMIC; antenna arrays; antenna feeds; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; printed circuits; radio applications; MMIC; PCB; antenna-circuit interfaces; differential antennas; differential feeding; dual grid array antennas; flip-chip bonding; flip-chip interconnection; frequency 60 GHz; highly integrated radios; low temperature cofired ceramic technology; microwave monolithic integrated circuits; patterned ground plane; printed circuit board; single-ended antennas; thin-profile package; Antenna arrays; Antenna feeds; Antenna radiation patterns; Arrays; Gain; Microstrip; 60-GHz radio; Ball grid array package; grid array antenna; low temperature cofired ceramic (LTCC);
Journal_Title :
Antennas and Propagation, IEEE Transactions on
DOI :
10.1109/TAP.2011.2109358