• DocumentCode
    1438109
  • Title

    Analysis of thermal instability in multi-finger power AlGaAs/GaAs HBT´s

  • Author

    Lu, Ke ; Snowden, Christopher M.

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Leeds Univ., UK
  • Volume
    43
  • Issue
    11
  • fYear
    1996
  • fDate
    11/1/1996 12:00:00 AM
  • Firstpage
    1799
  • Lastpage
    1805
  • Abstract
    A new theory is developed in this paper to explain the collapse of current gain in multi-finger power AlGaAs/GaAs Heterojunction Bipolar Transistors (HBT´s). The reasons behind this unwanted phenomenon are fully clarified using a simple model to investigate the thermo-electrical interaction between the fingers. The existence of multi-value equilibrium points in model´s constitutive equations is shown to be the necessary condition for the collapse of current gain to appear. For a N-finger device, N different patterns of collapse exist. The criterion to select the global stable pattern is given. The method has been used to predict the collapse in AlGaAs/GaAs HBT´s and the agreement is excellent. The method also predicts that the collapse can happen far earlier than is normally expected in multi-finger high-power devices. The influence of ballasting resistance and thermal resistance is also investigated
  • Keywords
    III-V semiconductors; aluminium compounds; current distribution; gallium arsenide; heterojunction bipolar transistors; microwave bipolar transistors; microwave power transistors; power bipolar transistors; semiconductor device models; thermal resistance; thermal stability; AlGaAs-GaAs; ballasting resistance; collapse patterns; current gain collapse; global stable pattern selection criterion; microwave industry; microwave power modules; model; multi-finger power AlGaAs/GaAs HBT; multi-value equilibrium points; nonlinear I-V-T relationships; thermal instability; thermal resistance; thermo-electrical interaction; Current density; Equations; Fingers; Gallium arsenide; Heterojunction bipolar transistors; Microwave devices; Power amplifiers; Temperature distribution; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.543010
  • Filename
    543010