• DocumentCode
    1438396
  • Title

    Foreword thermal investigations of ICs and microstructures (THERMINIC)

  • Volume
    21
  • Issue
    3
  • fYear
    1998
  • Firstpage
    397
  • Lastpage
    398
  • Keywords
    Actuators; Circuit testing; Components, packaging, and manufacturing technology; Conferences; Electronic packaging thermal management; Integrated circuit modeling; Integrated circuit packaging; Microstructure; System testing; Temperature measurement;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/TCPMA.1998.725201
  • Filename
    725201
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1438396