Title :
A thermal benchmark chip: design and applications
Author :
Székely, Vladimir ; Márta, Csaba ; Rencz, Márta ; Végh, Gerzson ; Benedek, Zsolt ; Török, Sandor
Author_Institution :
Dept. of Electron. Devices, Budapest Tech. Univ., Hungary
fDate :
9/1/1998 12:00:00 AM
Abstract :
A 1.2-μm complementary metal-oxide-semiconductor (CMOS) thermal benchmark chip has been designed, fabricated and tested. The chip is suitable to support various steady-state and transient measurements, e.g., heating and cooling curves, in-chip thermal couplings. It facilitates the calibration of various chip temperature mapping equipment. Besides the description of the chip design experimental results are presented in order to demonstrate the wide usability of this measurement supporting tool
Keywords :
CMOS integrated circuits; calibration; integrated circuit packaging; temperature sensors; 1.2 micron; CMOS thermal benchmark chip; calibration; chip temperature mapping equipment; cooling curve; design; heating curve; in-chip thermal coupling; steady-state measurement; transient measurement; Benchmark testing; Cooling; Current measurement; Electrical resistance measurement; Frequency; Integrated circuit packaging; Semiconductor device measurement; Sensor phenomena and characterization; Temperature sensors; Thermal resistance;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
