Title :
Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation
Author :
Rzepka, Sven ; Banerjee, Kaustav ; Meusel, Ekkehard ; Hu, Chenming
Author_Institution :
Tech. Univ. Dresden, Germany
fDate :
9/1/1998 12:00:00 AM
Abstract :
In this paper, self-heating of interconnects has been shown to affect the lifetime of next generation integrated circuits significantly more severely than today´s. The paper proves the necessity for extending the system of design rules, proposes a thermal design rule, and presents an efficient and quantitatively accurate thermal simulator as tool for the design process
Keywords :
VLSI; finite element analysis; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; VLSI interconnect line; design rule; integrated circuit lifetime; self-heating; thermal finite element simulation; Circuit simulation; Current density; Electromigration; Finite element methods; Heating; Integrated circuit interconnections; Process design; Temperature dependence; Temperature sensors; Very large scale integration;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
