Title :
Switching characteristics of MCT´s and IGBT´s in power converters
Author :
Trivedi, Malay ; Pendharkar, S. ; Shenai, K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
fDate :
11/1/1996 12:00:00 AM
Abstract :
The performances of the Insulated Gate Bipopar Transistor (IGBT) and MOS-Controlled Thyristor (MCT) in hard- and soft-switching applications are studied in detail, both experimentally and by using numerical simulations. Simulated results show good qualitative agreement with the measured data under a wide range of circuit operating conditions. The simulation results are obtained from an advanced mixed device and circuit simulator in which the device under test (DUT) is represented by a two-dimensional (2-D) grid structure and the internal plasma dynamics is studied using a finite element numerical solution technique. A comparison is then made between the switching performance of the bipolar transistor-like device (IGBT) and a thyristor-like device (MCT) in power converters. It is shown that due to a basic difference in the turn-off mechanism, whereas an IGBT shows a tail-current “bump” due to electric field buildup during turn-off, the MCT shows a turn-off “shoulder” due to current flow through the turn-off MOS channel. This leads to much higher losses for MCT than IGBT under identical operating conditions. Furthermore, since the turn-off of MCT involves removal of more carriers from the drift-region, the turn-off is slower than IGBT
Keywords :
MOS-controlled thyristors; finite element analysis; insulated gate bipolar transistors; power convertors; power semiconductor switches; power system transients; semiconductor device models; semiconductor device testing; thyristor applications; IGBT; MCT; MOS-controlled thyristor; circuit operating conditions; current transient; device under test; drift-region carrier removal; electric field buildup; finite element numerical solution; forward I-V characteristics; hard-switching application; internal plasma dynamics; losses; mixed device/circuit simulator; numerical simulation; power converters; soft-switching application; switching performance; tail-current bump; turn-off mechanism; turn-off shoulder; two-dimensional grid structure; voltage transient; Circuit simulation; Circuit testing; Insulated gate bipolar transistors; Insulation; MOSFETs; Numerical simulation; Plasma measurements; Plasma simulation; Switching converters; Thyristors;
Journal_Title :
Electron Devices, IEEE Transactions on