• DocumentCode
    1438804
  • Title

    A hierarchical reliability analysis for circuit design evaluation

  • Author

    Riege, S.P. ; Thompson, C.V. ; Clement, J.J.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., MIT, Cambridge, MA, USA
  • Volume
    45
  • Issue
    10
  • fYear
    1998
  • fDate
    10/1/1998 12:00:00 AM
  • Firstpage
    2254
  • Lastpage
    2257
  • Abstract
    We suggest a computationally efficient and flexible strategy for assessment of reliability of integrated circuits. The concept of hierarchical reliability analysis proposed relies on doing reliability assessments during the design and layout process [reliability computer aided design (RCAD)]. Design rules are suggested based on calculations of steady-state mechanical stresses built up in interconnect graphs and trees due to electromigration. These design rules identify a large fraction of interconnect graphs in a typical design as immune to electromigration-induced failure. The stated design rules are an extension of the Blech-length concept to interconnect graphs. Our suggested new strategy will have important implications for design and layout processes as design limits for a given technology are reached
  • Keywords
    VLSI; circuit CAD; electromigration; integrated circuit design; integrated circuit interconnections; integrated circuit layout; integrated circuit modelling; integrated circuit reliability; internal stresses; stress analysis; thermal stresses; 1D stress model; IC design evaluation; design rules; electromigration; electromigration-induced failure immunity; hierarchical reliability analysis; integrated circuits; interconnect graphs; interconnect trees; layout process; reliability CAD; reliability computer aided design; steady-state mechanical stresses; Circuit analysis; Circuit synthesis; Electromigration; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit technology; Process design; Steady-state; Stress; Tree graphs;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.725264
  • Filename
    725264