DocumentCode :
1438804
Title :
A hierarchical reliability analysis for circuit design evaluation
Author :
Riege, S.P. ; Thompson, C.V. ; Clement, J.J.
Author_Institution :
Dept. of Mater. Sci. & Eng., MIT, Cambridge, MA, USA
Volume :
45
Issue :
10
fYear :
1998
fDate :
10/1/1998 12:00:00 AM
Firstpage :
2254
Lastpage :
2257
Abstract :
We suggest a computationally efficient and flexible strategy for assessment of reliability of integrated circuits. The concept of hierarchical reliability analysis proposed relies on doing reliability assessments during the design and layout process [reliability computer aided design (RCAD)]. Design rules are suggested based on calculations of steady-state mechanical stresses built up in interconnect graphs and trees due to electromigration. These design rules identify a large fraction of interconnect graphs in a typical design as immune to electromigration-induced failure. The stated design rules are an extension of the Blech-length concept to interconnect graphs. Our suggested new strategy will have important implications for design and layout processes as design limits for a given technology are reached
Keywords :
VLSI; circuit CAD; electromigration; integrated circuit design; integrated circuit interconnections; integrated circuit layout; integrated circuit modelling; integrated circuit reliability; internal stresses; stress analysis; thermal stresses; 1D stress model; IC design evaluation; design rules; electromigration; electromigration-induced failure immunity; hierarchical reliability analysis; integrated circuits; interconnect graphs; interconnect trees; layout process; reliability CAD; reliability computer aided design; steady-state mechanical stresses; Circuit analysis; Circuit synthesis; Electromigration; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit technology; Process design; Steady-state; Stress; Tree graphs;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.725264
Filename :
725264
Link To Document :
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