Title :
Electron collision dose enhancement
Author_Institution :
Lockheed Martin Missiles & Space, San Jose, CA, USA
fDate :
12/1/2000 12:00:00 AM
Abstract :
High-Z layers in IC packages and on IC die slow and reflect incident electron fluxes much more effectively than low-Z layers. In typical nuclear and space environments, high-Z solder bonds can enhance the electron collision dose by up to 85%, and Au-plated lids can enhance it by up to 50%
Keywords :
cosmic ray interactions; electron beam effects; integrated circuit packaging; nuclear electronics; space vehicle electronics; IC die; IC packages; high-Z layers; incident electron fluxes; nuclear environments; plated lids; solder bonds; space environments; Atomic layer deposition; Backscatter; Ceramics; Electron beams; Geometry; Integrated circuit packaging; Metallization; Optical reflection; Silicides; Slabs;
Journal_Title :
Nuclear Science, IEEE Transactions on
