• DocumentCode
    1441675
  • Title

    Thermal-stress effects and enhanced low dose rate sensitivity in linear bipolar ICs

  • Author

    Shaneyfelt, M.R. ; Schwank, J.R. ; Witczak, S.C. ; Fleetwood, D.M. ; Pease, R.L. ; Winokur, P.S. ; Riewe, L.C. ; Hash, G.L.

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • Volume
    47
  • Issue
    6
  • fYear
    2000
  • fDate
    12/1/2000 12:00:00 AM
  • Firstpage
    2539
  • Lastpage
    2545
  • Abstract
    A pre-irradiation elevated-temperature stress is shown to have a significant impact on the radiation response of a linear bipolar circuit. Thermal cycling can lead to part-to-part variability in the radiation response of circuits packaged from the same wafer. In addition, it is demonstrated that a pre-irradiation elevated-temperature stress can significantly impact the enhanced low dose rate sensitivity (ELDRS) of the LM111 voltage comparator. Thermal stress moderates and, in some cases, eliminates ELDRS. The data are consistent with space charge models. These results suggest that there may be a connection between the mechanisms responsible for thermal-stress effects and ELDRS in linear circuits. Implications of these results for hardness assurance testing and mechanisms are discussed
  • Keywords
    bipolar analogue integrated circuits; comparators (circuits); integrated circuit modelling; integrated circuit reliability; integrated circuit testing; radiation effects; radiation hardening (electronics); thermal stresses; LM111 voltage comparator; enhanced low dose rate sensitivity; hardness assurance testing; linear bipolar ICs; part-to-part variability; pre-irradiation elevated-temperature stress; radiation response; space charge models; thermal cycling; thermal-stress effects; Annealing; CMOS technology; Circuits; Laboratories; Packaging; Positron emission tomography; Space charge; Thermal stresses; US Department of Energy; Voltage;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.903805
  • Filename
    903805