DocumentCode :
1441690
Title :
Ultra-Compact WiMAX Bandpass Filter Embedded Into a Printed Circuit Board With a {\\rm SrTiO}_{3} Composite Layer
Author :
Cheon, Seong Jong ; Lim, Sung Phyo ; Park, Jae Yeong
Author_Institution :
Dept. of Electron. Eng., Kwangwoon Univ., Seoul, South Korea
Volume :
2
Issue :
3
fYear :
2012
fDate :
3/1/2012 12:00:00 AM
Firstpage :
375
Lastpage :
382
Abstract :
An ultra-compact bandpass filter has been developed for 2.3-2.7 GHz worldwide interoperability used for microwave access applications. The proposed filter was fully embedded into a multilayered printed circuit board (PCB) with a high dielectric strontium titanate (SrTiO3) composite film layer. In order to reduce the size of the filter and to avoid unwanted 3-D electromagnetic coupling between the embedded passive filter circuit elements, the proposed filter was designed using J-inverter transformation technology. Two grounding via inductors and a single grounding capacitor were also utilized to generate three independent finite transmission zeros to enhance the rejection characteristics at the proper frequency bands. Since the J-inverter transformed filter circuit elements could be designed with relatively small inductance and large capacitance values, the high dielectric composite film was highly effective in reducing the size and improving the performance of the filter. The high dielectric film exhibited a dielectric constant of 17, a tangent loss of 0.01, and a capacitance density of 12.2 pF/mm2 at 1 GHz. The measured maximum insertion loss in the passband ranged from 2.3 to 2.7 GHz was better than 1.8 dB, with a minimum value of 1.58 dB at 2.6 GHz. The return loss was higher than 15 dB in the passband. The transmission zeros occurred at 1.71 and 5.1 GHz, and provided suppressions of 45 dB at 1.71 GHz, and 54 dB at 5.1 GHz, respectively. The measured group delay was less than 0.8 ns in the passband. The embedded bandpass filter had a volume of 2.6 × 2.6 × 0.55 (H) mm3, which is the smallest one found, compared to previously reported devices, the filter, embedded into the eight-layered packaging substrate with the high dielectric composite layer, dramatically reduced the size up to 56%, and its performance was also much improved in comparison to the one embedded into a conventional six- layered PCB.
Keywords :
WiMax; band-pass filters; embedded systems; permittivity; poles and zeros; printed circuits; strontium compounds; 3D electromagnetic coupling; J-inverter transformation; SrTiO3; capacitance density; composite film layer; composite layer; dielectric constant; eight-layered packaging substrate; embedded passive filter circuit elements; frequency 1.71 GHz; frequency 2.3 GHz to 2.7 GHz; frequency 5.1 GHz; grounding capacitor; group delay; high dielectric composite film; printed circuit board; tangent loss; transmission zeros; ultra-compact WiMAX bandpass filter; worldwide interoperability used for microwave access; Capacitance; Capacitors; Filtering theory; Inductance; Inductors; WiMAX; $J$-inverter; bandpass filters; embedded passive components; independent transmission zeros; multilayered printed circuit board (PCB); worldwide interoperability for microwave access (WiMAX);
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2011.2179044
Filename :
6146406
Link To Document :
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