DocumentCode :
1443794
Title :
LDMOS Transistor High-Frequency Performance Enhancements by Strain
Author :
Chen, Kun-Ming ; Huang, Guo-Wei ; Chen, Bo-Yuan ; Chiu, Chia-Sung ; Hsiao, Chih-Hua ; Liao, Wen-Shiang ; Chen, Ming-Yi ; Yang, Yu-Chi ; Wang, Kai-Li ; Liu, Chee Wee
Author_Institution :
Nat. Nano Device Labs., Hsinchu, Taiwan
Volume :
33
Issue :
4
fYear :
2012
fDate :
4/1/2012 12:00:00 AM
Firstpage :
471
Lastpage :
473
Abstract :
The effects of mechanical stress on the dc and high-frequency performances of laterally diffused MOS (LDMOS) transistors with different layout structures were investigated by using the wafer bending method. A 3.1% peak cutoff frequency (fT) enhancement is achieved for the multifinger device under 0.051% biaxial tensile strain. For LDMOS with annular layout, the fT enhancement is increased to 3.7% due to the various channel directions. Our results suggest the strain technology can be adopted in LDMOS for RF applications. The transconductance and gate capacitance were also extracted to clearly demonstrate the fT variations.
Keywords :
MOSFET; bending; stress effects; stress-strain relations; LDMOS transistor; annular layout; biaxial tensile strain; gate capacitance; high-frequency performance enhancements; laterally diffused MOS transistors; layout structures; mechanical stress effect; multifinger device; peak cutoff frequency enhancement; strain technology; transconductance; wafer bending method; Layout; Logic gates; Performance evaluation; Radio frequency; Silicon; Strain; Transistors; Annular layout; biaxial tensile strain; cutoff frequency; laterally diffused MOS (LDMOS); mechanical stress;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2011.2182494
Filename :
6148255
Link To Document :
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