Title :
High integration density capacitors directly integrated in a single copper layer of printed circuit boards
Author :
Taroata, Dan ; Fischer, Wolf-Joachim ; Cheema, Tarik Ali ; Garnweitner, Georg ; Schmid, Günter
Author_Institution :
Inst. of Semicond. & Microsyst., Tech. Univ. Dresden, Dresden, Germany
fDate :
2/1/2012 12:00:00 AM
Abstract :
Direct integration of capacitors in printed circuit boards with high integration densities and electrical properties comparable to surface mount ceramic capacitors is reported, achieving a device-yield of >;90%. The insulation properties are determined through a self assembled monolayer, whereas the dielectric properties are defined by a ceramic thin-film fabricated from chemically modified highly crystalline BaTiO3 and ZrO2 nanoparticles.
Keywords :
barium compounds; ceramic capacitors; copper; insulation; metallic thin films; monolayers; nanoparticles; printed circuits; self-assembly; surface mount technology; zirconium compounds; BaTiO3; Cu; ZrO2; capacitor direct integration; ceramic thin-film fabrication; crystalline nanoparticle; dielectric properties; electrical properties; high integration density capacitor; insulation properties; printed circuit board; self assembled monolayer; single copper layer; surface mount ceramic capacitor; Capacitors; Copper; Dispersion; Electrodes; Nanoparticles; Surface treatment; Embedded capacitors; nanoparticle dispersion; printed circuit boards; self assembled monolayer;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2012.6148531
