• DocumentCode
    1444830
  • Title

    Pressure limits for the vacuum arc deposition technique

  • Author

    Meunier, Jean-Luc

  • Author_Institution
    Dept. of Chem. Eng., McGill Univ., Montreal, Que., Canada
  • Volume
    18
  • Issue
    6
  • fYear
    1990
  • fDate
    12/1/1990 12:00:00 AM
  • Firstpage
    904
  • Lastpage
    910
  • Abstract
    Observations of the cathodic copper plasma expansion at low pressures of He, Ar, and SF6 showed that, for background gas mass densities of ρg=1 to 4×10-4 kg/m 3 and higher, the plasma and gas are separated into two volumes. A shock wave acts as a boundary between the two volumes. The boundary attains a stationary position once its expansion velocity decreases to the velocity of sound in the background gas. This position corresponds to a distance Rc to the cathode that agrees with a snowplow expansion model, giving Rc βf=Er, where f is a function of the arc current and background gas characteristics, E r is the erosion rate of the cathode, and β varies between 2.1 and 2.5. The interaction model is based on kinetic energy exchanges between two gas-like volumes without other energy losses. A maximum pressure limit for vacuum arc deposition is set for ρg /I=2 to 9×10-6 kg/m3 A
  • Keywords
    arcs (electric); copper; plasma deposition; plasma pressure; plasma shock waves; vacuum deposition; Ar; He; SF6; cathodic Cu plasma; pressure limits; shock wave; snowplow expansion; vacuum arc deposition; Argon; Cathodes; Copper; Helium; Kinetic energy; Plasma density; Plasma waves; Shock waves; Vacuum arcs; Vacuum technology;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/27.61501
  • Filename
    61501