DocumentCode
1444830
Title
Pressure limits for the vacuum arc deposition technique
Author
Meunier, Jean-Luc
Author_Institution
Dept. of Chem. Eng., McGill Univ., Montreal, Que., Canada
Volume
18
Issue
6
fYear
1990
fDate
12/1/1990 12:00:00 AM
Firstpage
904
Lastpage
910
Abstract
Observations of the cathodic copper plasma expansion at low pressures of He, Ar, and SF6 showed that, for background gas mass densities of ρg=1 to 4×10-4 kg/m 3 and higher, the plasma and gas are separated into two volumes. A shock wave acts as a boundary between the two volumes. The boundary attains a stationary position once its expansion velocity decreases to the velocity of sound in the background gas. This position corresponds to a distance R c to the cathode that agrees with a snowplow expansion model, giving R c βf =E r, where f is a function of the arc current and background gas characteristics, E r is the erosion rate of the cathode, and β varies between 2.1 and 2.5. The interaction model is based on kinetic energy exchanges between two gas-like volumes without other energy losses. A maximum pressure limit for vacuum arc deposition is set for ρg /I =2 to 9×10-6 kg/m3 A
Keywords
arcs (electric); copper; plasma deposition; plasma pressure; plasma shock waves; vacuum deposition; Ar; He; SF6; cathodic Cu plasma; pressure limits; shock wave; snowplow expansion; vacuum arc deposition; Argon; Cathodes; Copper; Helium; Kinetic energy; Plasma density; Plasma waves; Shock waves; Vacuum arcs; Vacuum technology;
fLanguage
English
Journal_Title
Plasma Science, IEEE Transactions on
Publisher
ieee
ISSN
0093-3813
Type
jour
DOI
10.1109/27.61501
Filename
61501
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