• DocumentCode
    1445089
  • Title

    A Flexible Time-Stepping Scheme for Hybrid Field-Circuit Simulation Based on the Extended Time-Domain Finite Element Method

  • Author

    Wang, Rui ; Jin, Jian-Ming

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • Volume
    33
  • Issue
    4
  • fYear
    2010
  • Firstpage
    769
  • Lastpage
    776
  • Abstract
    This paper describes a flexible time-stepping scheme for a recently developed hybrid field-circuit solver based on the extended time-domain finite element method (TDFEM) to alleviate the limitation on the use of a system-wide global time-step size. The proposed time-stepping scheme generalizes the strict synchronous coupling mechanism between the FEM and circuit subsystems and allows the signals in the different subsystems to be tracked and sampled at different time-step sizes. The signals from a slow subsystem with a larger time-step size are extrapolated, when necessary, for updating the signals in a fast subsystem with a smaller time-step size. The capability of the hybrid field-circuit solver with the proposed time-stepping scheme is further enhanced by the application of a tree-cotree splitting technique to the FEM subsystem, which helps reduce the iteration count per time step for a preconditioned iterative solution when the time-step size of the FEM subsystem becomes relatively large. With the flexibility of choosing subsystem-specific time-step sizes, the proposed time-stepping scheme improves the computational efficiency of the existing TDFEM-based hybrid field-circuit solver especially when the computational cost associated with the slow subsystems is much higher than that associated with the fast subsystems.
  • Keywords
    circuit simulation; finite element analysis; iterative methods; time-domain analysis; trees (mathematics); FEM subsystem; TDFEM; circuit subsystems; computational efficiency; extended time-domain finite element method; extrapolation; flexible time-stepping scheme; hybrid field-circuit simulation; hybrid field-circuit solver; preconditioned iterative solution; subsystem-specific time-step sizes; synchronous coupling mechanism; system-wide global time-step size; tree-cotree splitting technique; Analytical models; Circuit simulation; Circuit subsystems; Computational efficiency; Computational modeling; Finite element methods; Microwave antenna arrays; Microwave circuits; Microwave devices; Time domain analysis; Hybrid solver; multirate simulation; time-domain finite element method; time-stepping scheme; transient analysis;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2010.2044411
  • Filename
    5433253