• DocumentCode
    1445624
  • Title

    Architecture, defect tolerance, and buffer design for a new ATM switch

  • Author

    Jain, Vijay K. ; Lin, Lei ; Horiguchi, Susumu

  • Author_Institution
    University of South Florida, Tampa, FL 33620 USA
  • Volume
    21
  • Issue
    4
  • fYear
    1998
  • Firstpage
    338
  • Lastpage
    345
  • Abstract
    This paper presents a modular architecture for a scalable ATM-switch. The cell routing function, as well as the associated queueing, are distributed over many small clusters of nodes, called basic modules. These basic modules are hierarchically interconnected to form larger switches. In a basic module, every node is interconnected with adjacent nodes in the same module with three of its four links. The fourth link is used to connect either to an external port or to other basic modules at higher levels of the hierarchy. From a hardware implementation perspective, the simplicity of the architecture stems from the fact that each node in the switch consists of two small crossbar switches of low complexity, a buffer, and a controller. The hierarchial nature of the topology allows for modular growth of the switch. Further, the interconnection topology of the switch makes it suitable for three-dimensional (3-D) (stacked VLSI) implementation.
  • Keywords
    built-in self test; design for testability; fault diagnosis; integrated circuit economics; integrated circuit modelling; integrated circuit testing; integrated circuit yield; multichip modules; built-in self test; design for test; economics modeling; fault diagnosis; multichip module testing strategies; payback; rework strategies; test effectiveness parameters; test strategy; yield; Automatic testing; Built-in self-test; Costs; Data analysis; Design for testability; Environmental economics; Fault diagnosis; Integrated circuit testing; Multichip modules; System testing; 3-D VLSI; Asynchronous transfer mode (ATM); broadband switches; defect tolerance; hierarchical switch; modular architecture; redundancy; routing; tera-switch; yield;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.730417
  • Filename
    730417