Interface reaction between Ag-Pd conductor and Pd-Sn solder

Author

Moriya, Yoichi ; Yamade, Yoshiaki ; Shinya, Ryuji

Author_Institution

Sumitomo Metal Industries, Ltd., Hyogo 660-0891, Japan

Volume

21

Issue

4

fYear

1998

Firstpage

394

Lastpage

397

Abstract

The intermetallic compound layer between Pb-Sn solder and Ag-Pd conductor after aging at 150 °C has been studied. Elemental and phase distributions of this layer has been probed using SEM, EPMA and EDX. The investigation of the microstructure of the layer with EPMA liner analysis reveals segregation of Ag-rich and Pd-rich phases Quantitative EDX analysis results show that the Ag-rich phase contains Ag and Sn with the Ag/Sn ratio around 3/1, and the Pd-rich phase Pd and Sn with the Pd/Sn ratio around 1/4. These phases are confirmed to be the intermetallic compounds Ag3Sn and PdSn4, respectively.

Keywords

elastic moduli; filled polymers; finite element analysis; moulding; plastic packaging; thermal expansion; thermal stresses; Hashin-Shtrikman bound; Shapery bound; coefficient of thermal expansion; dilute suspension method; elastic modulus; electronic packaging; epoxy molding compound; filler; finite element method; self-consistent method; thermal stress; three-dimensional analysis; two-dimensional analysis; Electromagnetic compatibility; Equations; Finite element methods; Material properties; Packaging; Performance analysis; Shape measurement; Thermal expansion; Thermal stresses; Upper bound; Aging; intermetallic; solder joint; surface mount technology;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.730423

Filename

730423