Title :
Interface reaction between Ag-Pd conductor and Pd-Sn solder
Author :
Moriya, Yoichi ; Yamade, Yoshiaki ; Shinya, Ryuji
Author_Institution :
Sumitomo Metal Industries, Ltd., Hyogo 660-0891, Japan
Abstract :
The intermetallic compound layer between Pb-Sn solder and Ag-Pd conductor after aging at 150 °C has been studied. Elemental and phase distributions of this layer has been probed using SEM, EPMA and EDX. The investigation of the microstructure of the layer with EPMA liner analysis reveals segregation of Ag-rich and Pd-rich phases Quantitative EDX analysis results show that the Ag-rich phase contains Ag and Sn with the Ag/Sn ratio around 3/1, and the Pd-rich phase Pd and Sn with the Pd/Sn ratio around 1/4. These phases are confirmed to be the intermetallic compounds Ag3Sn and PdSn4, respectively.
Keywords :
elastic moduli; filled polymers; finite element analysis; moulding; plastic packaging; thermal expansion; thermal stresses; Hashin-Shtrikman bound; Shapery bound; coefficient of thermal expansion; dilute suspension method; elastic modulus; electronic packaging; epoxy molding compound; filler; finite element method; self-consistent method; thermal stress; three-dimensional analysis; two-dimensional analysis; Electromagnetic compatibility; Equations; Finite element methods; Material properties; Packaging; Performance analysis; Shape measurement; Thermal expansion; Thermal stresses; Upper bound; Aging; intermetallic; solder joint; surface mount technology;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
