Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading — Part III: Material properties and package geometries

Author

Saitoh, Takehiro ; Matsuyama, Hidehito ; Toya, Masayuki

Author_Institution

NEC Corporation, Kanagawa 229, Japan

Volume

21

Issue

4

fYear

1998

Firstpage

407

Lastpage

412

Abstract

In our previous reports [1], [2], geometries of the delaminations which are most likely to lead to resin cracking in large scale integration (LSI) packages subjected to temperature cyclic loading were identified for both Cu alloy and alloy 42 leadframe packages. In this paper, assuming these delaminations, we conduct comprehensive numerical stress analysis of resin cracking to study the effect of properties of encapsulant resin and die-bonding materials and the package geometry factors. The impacts of these design parameters on resin cracking are determined and package design guide is established.

Keywords

integrated circuit noise; integrated circuit packaging; large scale integration; 600 MHz; 622.08 Mbit/s; FR4 substrate; LSI; frequency response; insulator thin film; low-cost technique; power supply plane; simultaneous switching noise; sub-board packaging; Capacitors; Conductive films; Connectors; Frequency response; Insulation; Large scale integration; Noise reduction; Packaging; Substrates; Telecommunication switching; Die-bonding material; LSI; encapsulant resin; finite element method; fracture mechanics; leadframe; package; resin cracking; stress analysis; stress singularity; temperature cyclic loading; thermal stress;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.730425

Filename

730425