Title :
Reduced-Size Low-Voltage RF MEMS X-Band Phase Shifter Integrated on Multilayer Organic Package
Author :
Chung, David J. ; Polcawich, Ronald G. ; Pulskamp, Jeffrey S. ; Papapolymerou, John
Author_Institution :
Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper presents an X-band two-bit phase shifter that integrates single-pole four-throw (SP4T) piezoelectric microelectromechanical switches with a compact 3-D passive design on a liquid crystal polymer (LCP) organic substrate. The multilayer LCP process allows a low-cost and lightweight circuit that can easily be integrated with other radio frequency front-end components, such as an antenna, at the packaging level. By routing lines onto embedded multilayers, a 22.5% reduction in area is achieved. In addition, low-loss piezoelectric SP4T switches with a 7 V actuation voltage are used to switch between different phase delays. The phase shifter exhibits a loss of 0.75 dB/bit with 2.25° average phase error at 10 GHz.
Keywords :
electronics packaging; liquid crystal polymers; microswitches; microwave phase shifters; antenna; compact 3D passive design; embedded multilayers; frequency 10 GHz; lightweight circuit; liquid crystal polymer organic substrate; low-cost circuit; low-loss piezoelectric SP4T switches; multilayer LCP process; multilayer organic package; packaging level; phase delays; radiofrequency front-end components; reduced-size low-voltage RF MEMS X-band phase shifter; routing lines; single-pole four-throw piezoelectric microelectromechanical switches; voltage 7 V; Micromechanical devices; Microswitches; Nonhomogeneous media; Phase shifters; Phased arrays; Radio frequency; Wires; Liquid crystal polymers; microelectromechanical systems; phase shifters; piezoelectric devices; radio frequency;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2012.2184112
