Title :
Multidimensional VCSEL-array push/pull module fabricated using the self-alignment mounting technique
Author :
Kosaka, Hideo ; Kajita, Mikihiro ; Sugimoto, Yoshimasa
Author_Institution :
NEC Opto-Electronics Research Laboratories, Ibaraki 305, Japan
Abstract :
We have developed plastic-molded receptacle-lope vertical-cavity surface-emitting laser (VCSEL)-array modules directly push/pull connectable with the one-dimensional (1-D) conventional mechanically-transferable multifiber push-on (MPO) fiber connector and with a new two-dimensional (2-D) MPO-compatible fiber connector developed for this module. The VCSEL was mounted on the plastic-molded package using a highly precise completely alignment-free process using flip-chip solder bonding and ball-guide die bonding. These modules exhibit an optical coupling loss of 0.67 ± 0.23 dB (efficiency: 85.8 ± 2.93%) and a loss deviation of less than 0.26 dB for 100 matings with the fiber connector (MMF50). The modules were operated at a bit rate of 1 Gbps/ch without an isolator and showed floor-less bit error rate (BER) performance at temperatures up to 70 °C. At 1 Gbps/ch their optical sensitivity at a BER of 10−11 was −26.0 dBm ± 0.9 dB. These structures and techniques are applicable to high-density, high-throughput optical parallel interconnections and optical space-division switches.
Keywords :
Optical fiber coupling; optical interconnections; parallel processing; plastic packaging; semiconductor device packaging; semiconductor laser arrays; surface mounting; surface-emitting lasers;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TCPMB.1998.730433