• DocumentCode
    1445770
  • Title

    Aggravated Electromigration of Power Distribution Networks in ULSI Devices Due to Local Resonant Oscillations

  • Author

    Livshits, Pavel ; Rysin, Alexander ; Sofer, Sergey

  • Author_Institution
    Sch. of Eng., Bar-Ilan Univ., Ramat Gan, Israel
  • Volume
    12
  • Issue
    2
  • fYear
    2012
  • fDate
    6/1/2012 12:00:00 AM
  • Firstpage
    363
  • Lastpage
    368
  • Abstract
    In this paper, the impact of resonant voltage oscillations, triggered on on-die power supply and ground grids by switching of active elements, upon electromigration (EM) and Joule heating of the interconnects, constituting the grids, has been studied. The recorded voltage waveforms inside a working microchip reveal that the voltage oscillations on these grids can locally attain amplitude that is even higher than 10% with regard to the supply voltage. It was observed that these oscillations can appear with an opposite phase at two adjacent power grid areas, thus giving rise to strong currents. These experimentally measured waveforms have been taken as a basis for our calculations. The results reveal that resonant voltage oscillations on both power supply and ground grids lead to a substantial aggravation of both EM and Joule heating. Furthermore, it was found that the situation is aggravated with the growth of the voltage oscillations´ frequency.
  • Keywords
    ULSI; electromigration; EM heating; Joule heating; ULSI devices; active elements; adjacent power grid areas; ground grids; local resonant oscillations; microchip; on-die power supply; power distribution network aggravated electromigration; power supply; resonant voltage oscillations; voltage waveforms; CMOS integrated circuits; Electromigration; Integrated circuit interconnections; Oscillators; Power supplies; Reliability; Voltage measurement; Electromigration (EM) and Joule heating; ULSI microchips´ reliability; on-die power supply and ground grids; resonant voltage oscillations;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2012.2187058
  • Filename
    6151078