Title :
Anodic
Nonvolatile RRAM
Author :
Kundozerova, T.V. ; Grishin, A.M. ; Stefanovich, G.B. ; Velichko, A.A.
Author_Institution :
Dept. of Condensed Matter Phys., KTH R. Inst. of Technol., Stockholm, Sweden
fDate :
4/1/2012 12:00:00 AM
Abstract :
We report nonvolatile resistive switching in anodic niobium pentoxide thin-film memory cells. Highly dielectric Nb2O5 films were prepared at room temperature by the anodic oxidation of submicrometer-thick Nb films sputtered onto an Si wafer. After the electroforming process, Au/Nb2O5/Nb/Si sandwich memory cells demonstrate reproducible direct current and pulse mode switching between two resistance states with a resistance on-off ratio around 103. Low and high resististive states show ohmic conductivity and field-assisted Poole-Frenkel-type conductivity, respectively. Nonvolatile resistance storage was traced within 40 days to quantify retention characteristics of the Nb2O5 memristor. The low-temperature anodic oxidation of Nb was found to be feasible to fabricate high-density cross-point memory with 3-D stack structures.
Keywords :
dielectric thin films; electroforming; elemental semiconductors; gold; memristors; niobium compounds; random-access storage; silicon; thin film devices; 3D stack structures; Au-Nb2O5-Nb-Si; anodic nonvolatile RRAM; dielectric films; electroforming process; field-assisted Poole-Frenkel-type conductivity; high resistive states; high-density cross-point memory; low resistive states; low-temperature anodic oxidation; memristor; nonvolatile resistance storage; nonvolatile resistive switching; ohmic conductivity; pulse mode switching; reproducible direct current; resistance on-off ratio; sandwich memory cells; submicrometer-thick films; temperature 293 K to 298 K; thin-film memory cells; Dielectrics; Gold; Niobium; Nonvolatile memory; Resistance; Silicon; Switches; Conduction mechanism; dielectric film; impedance spectroscopy; memristor; niobium pentoxide; retention characteristics; unipolar resistance switching;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2011.2182515