Title : 
Composite HfO2/Al2O3-dielectric MOS-HEMTs by using RF sputtering/ozone water oxidation
         
        
            Author : 
Ching-Sung Lee ; Hung-Shi Huang ; Wei-Hsin Shung ; Ting-Ting Wu ; Cheng-Lung Yang ; Chuan-Chung Yeh ; Yu-Hao Liao ; Bo-Yi Chou ; Han-Yin Liu ; Wei-Chou Hsu
         
        
            Author_Institution : 
Dept. of Electron. Eng., Feng Chia Univ., Taichung, Taiwan
         
        
        
        
        
        
        
            Abstract : 
Enhanced device characteristics of InGaAs/AlGaAs MOS-HEMTs with HfO2/Al2O3 stacked dielectrics by separately using RF sputtering and ozone water oxidization are investigated in this work. Improved interfacial quality is verified by the measured 1/f spectra and C-V characteristics. k values of the HfO2/Al2O3 dielectrics are extracted to be 21.5/9.2, respectively. The effective oxide thickness (EOT) is 5.15 nm. The present MOS-HEMT has shown comprehensive improvements in intrinsic voltage gain (AV) and high-frequency performances. The present MOS-HEMT design is promising for MMIC applications.
         
        
            Keywords : 
III-V semiconductors; MOSFET; aluminium compounds; composite materials; gallium arsenide; hafnium compounds; high electron mobility transistors; indium compounds; oxidation; ozone; sputter deposition; 1/f spectra; C-V characteristics; HfO2-Al2O3; InGaAs-AlGaAs; MOS-HEMT; RF sputtering; composite-dielectric; effective oxide thickness; high-frequency performances; interfacial quality; intrinsic voltage gain; ozone water oxidation; stacked dielectrics; Aluminum oxide; Dielectrics; Gases; HEMTs; Hafnium compounds; Logic gates; MODFETs; HfO2/Al2O3 stacked dielectrics; MOS-HEMT; ozone water oxidation;
         
        
        
        
            Conference_Titel : 
Information Science, Electronics and Electrical Engineering (ISEEE), 2014 International Conference on
         
        
            Conference_Location : 
Sapporo
         
        
            Print_ISBN : 
978-1-4799-3196-5
         
        
        
            DOI : 
10.1109/InfoSEEE.2014.6947770