Title :
Estimating the Yield Strength of Thin Metal Films Through Elastic–Plastic Buckling-Induced Debonding
Author :
Goyal, S. ; Srinivasan, K. ; Subbarayan, G. ; Siegmund, T.
Author_Institution :
Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA
fDate :
6/1/2011 12:00:00 AM
Abstract :
In this correspondence, we propose a procedure to estimate the yield strength of thin films by debonding films from their substrate by elastic-plastic buckling under thermally induced compressive loading. The out-of-plane displacement of the metal lines under conditions of elastic-plastic buckling is dependent on the yield strength of the film. Thus, an inverse estimate of the yield strength is made from measurements of the out-of-plane displacements of the buckled metal lines. The procedure is demonstrated to estimate the yield strength of aluminum lines consistent with the measurements by other techniques.
Keywords :
aluminium; buckling; elastoplasticity; metallic thin films; yield strength; Al; aluminum thin films; elastic-plastic buckling-induced debonding; metal lines; out-of-plane displacement; thermally induced compressive loading; thin metal films; yield strength; Aluminum; Plastics; Resists; Substrates; Temperature measurement; Buckling; debond; metal films; yield strength;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2011.2112362