• DocumentCode
    1446192
  • Title

    Multi-Chip Module Packaging For W-Band {\\rm LiNbO}_{3} Modulator

  • Author

    Shireen, Rownak ; Shi, Shouyuan ; Yao, Peng ; Prather, Dennis W.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
  • Volume
    21
  • Issue
    3
  • fYear
    2011
  • fDate
    3/1/2011 12:00:00 AM
  • Firstpage
    145
  • Lastpage
    147
  • Abstract
    This letter presents ribbon bond transition of coplanar waveguides (CPWs) between two largely different dielectric constant materials, lithium niobate (LiNbO3) and alumina (Al2O3). The design plays an important role in multi-chip module (MCM) integrations of optoelectronic devices on LiNbO3 for the applications of millimeter-wave to optical signal processing. The impacts of ribbon bond parameters and CPW dimensions on the transmission characteristics are investigated over 100 GHz bandwidth. Simulated results are confirmed by measurements of the fabricated device.
  • Keywords
    alumina; coplanar waveguides; dielectric materials; lithium compounds; modulators; multichip modules; niobium compounds; optoelectronic devices; permittivity; Al2O3; CPW; LiNbO3; MCM; W-band modulator; coplanar waveguides; dielectric constant material; millimeter-wave; multichip module packaging; optical signal processing; optoelectronic device; ribbon bond transition; Bonding; Coplanar waveguides; Electrodes; Modulation; Optical waveguides; Substrates; Wire; ${rm LiNbO}_{3}$ ; Coplanar waveguide (CPW); packaging; ribbon bond;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2010.2103375
  • Filename
    5710596
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1446192