DocumentCode :
1447583
Title :
Electron thermalization distances and free ion yields in dense gases and liquids-effects of molecular structure
Author :
Gee, Norman ; Freeman, Gordon R.
Author_Institution :
Dept. of Chem., Alberta Univ., Edmonton, Alta., Canada
Volume :
23
Issue :
4
fYear :
1988
fDate :
8/1/1988 12:00:00 AM
Firstpage :
505
Lastpage :
508
Abstract :
Radiolysis free ion yields were measured as a function of electric-field strength in vapor/liquid equilibrium fluids of ethene, propene, cyclopropane, propane, n-butane and i-butane at 0.15c<3(dc=critical fluid density). From these yields, secondary electron thermalization distances bGP were estimated using the extended Onsager model. In the normal liquid at d/dc>1.5, the effects of molecular shape gave bGPd in methane>i-butane>ethane>propane>n-butane. The effect of pi -bonding gave n-butane>cyclopropane>ethene approximately propene; the permanent dipole of propene had negligible effect in the dense liquid. The conduction-band energy in supercritical fluids of n-butane, isobutane, n-pentane and isopentane was measured as a function of the fluid density. The conduction-band energy values in these fields show a density dependence that is related to their molecular structure. The correlation between the density dependence of conduction-band energy and of electron mobility is discussed in terms of the deformation potential theory.
Keywords :
carrier mobility; electric breakdown of liquids; energy loss of particles; ionisation of liquids; organic compounds; organic molecule configurations; radiolysis; conduction-band energy; critical fluid density; cyclopropane; deformation potential theory; dense gases; electric-field strength; electron mobility; ethene; extended Onsager model; free ion yields; i-butane; molecular structure; n-butane; pi -bonding; propane; propene; radiolysis; secondary electron thermalization distances; supercritical fluids; vapor/liquid equilibrium fluids; Bonding; Density measurement; Dielectrics; Electrons; Gases; Liquids; Pulse measurements; Shape; Thermal resistance; Yield estimation;
fLanguage :
English
Journal_Title :
Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9367
Type :
jour
DOI :
10.1109/14.7318
Filename :
7318
Link To Document :
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