DocumentCode :
1447597
Title :
Chipmakers bet on a stacked deck
Author :
Corley, Anne-Marie
Volume :
47
Issue :
4
fYear :
2010
fDate :
4/1/2010 12:00:00 AM
Firstpage :
14
Lastpage :
14
Abstract :
Imagine that your favorite aunt lies sick on the other side of town. Rather than brave the highways to visit her, you move her into your apartment building and just ride the elevator up.
Keywords :
Chip scale packaging; Earthquakes;
fLanguage :
English
Journal_Title :
Spectrum, IEEE
Publisher :
ieee
ISSN :
0018-9235
Type :
jour
DOI :
10.1109/MSPEC.2010.5434837
Filename :
5434837
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1447597
