• DocumentCode
    1448306
  • Title

    Structure and magnetic properties of (001) NiFe/NiMn/Co

  • Author

    Lai, Chih-Huang ; Wang, Yung-Hung ; Lien, W.C. ; Lo, C.K.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • Volume
    36
  • Issue
    5
  • fYear
    2000
  • fDate
    9/1/2000 12:00:00 AM
  • Firstpage
    2641
  • Lastpage
    2643
  • Abstract
    Textured and epitaxial (001)NiFe/NiMn/Co films were grown on Cu/Si(100) structural templates by using e-beam evaporation. Numerical analysis of high-resolution TEM images was used to determine the local d-spacing of NiMn. The local c/a ratio for the annealed sample varied across the film. The well-aligned orientation relationship between NiFe and NiMn stabilized the disordered NiMn phase, which resulted in a small exchange field. Interdiffusion was observed by energy dispersive X-ray spectroscopy near the interfaces of Cu/NiFe, NiFe/NiMn, and NiMn/Co. Interdiffusion may modify the interfacial structures, and may contribute to the enhancement of the coercivity in NiFe and Co
  • Keywords
    X-ray chemical analysis; chemical interdiffusion; cobalt; coercive force; interface structure; iron alloys; magnetic multilayers; magnetic thin films; manganese alloys; nickel alloys; texture; transmission electron microscopy; (001) NiFe/NiMn/Co films; Cu; Cu-Si; Cu/Si(100) structural template; EDX; NiFe-NiMn-Co; Si; coercivity; disordered NiMn phase; e-beam evaporation; energy dispersive X-ray spectroscopy; epitaxial films; exchange field; high-resolution TEM images; interdiffusion; interface structure; local c/a ratio; local d-spacing; magnetic properties; numerical analysis; orientation relationship; textured films; Annealing; Antiferromagnetic materials; Chemicals; Dispersion; Magnetic films; Magnetic properties; Semiconductor films; Spectroscopy; Spin valves; Temperature;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.908545
  • Filename
    908545