• DocumentCode
    1448692
  • Title

    Lateral polysilicon microrelays with a mercury microdrop contact

  • Author

    Simon, Jonathan ; Saffer, Scott ; Sherman, Faiz ; Kim, Chang-Jin

  • Author_Institution
    Dept. of Mech. Aerosp. & Nucl. Eng., California Univ., Los Angeles, CA, USA
  • Volume
    45
  • Issue
    6
  • fYear
    1998
  • fDate
    12/1/1998 12:00:00 AM
  • Firstpage
    854
  • Lastpage
    860
  • Abstract
    The authors present two designs for electrostatically actuated polysilicon relays with a stationary mercury microdrop contact: a large displacement cantilever design; and a comb-drive design, both fabricated using the multiuser microelectromechanical systems process of MCNC, Research Triangle Park, NC, USA. Microscale mercury relays combine the high density and batch fabrication of a microscale device with the quality and reliability of a mercury contact. Contact resistances of the devices were found to be ~1 kΩ in air with no attempt made to reduce the oxidation of the polysilicon and mercury surfaces. The devices can switch currents over 10 mA. Switching results are presented. The cantilever device is based on a curved electrode design, providing both relatively large force and large displacement of the tip, which contacts the mercury for switching. Nonlinear modeling of the beam movement is also provided. The comb-drive device has the usual double-folded beam design, but has a mercury drop near its center. Fabrication of 10-μm diameter mercury drops as the last step of the processing sequence is also discussed
  • Keywords
    contact resistance; electrical contacts; electrostatic actuators; semiconductor relays; semiconductor switches; 1 kohm; 10 mum; batch fabrication; beam movement nonlinear modeling; comb-drive design; contact resistance; current switching; curved electrode design; double-folded beam design; electrostatic actuation; fabrication; large displacement cantilever design; lateral polysilicon microrelays; mercury microdrop contact; microscale device; multiuser microelectromechanical systems process; processing sequence; Aerospace engineering; Contact resistance; Electrostatics; Fabrication; Microelectromechanical systems; Micromechanical devices; Microrelays; Oxidation; Relays; Switches;
  • fLanguage
    English
  • Journal_Title
    Industrial Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0046
  • Type

    jour

  • DOI
    10.1109/41.735328
  • Filename
    735328