• DocumentCode
    1449162
  • Title

    Electromagnetic Noise Suppression of LSI Packages Using Ferrite Film-Plated Lead Frame

  • Author

    Kondo, Koichi ; Takahata, Okikuni ; Ono, Hiroshi ; Yoshida, Shigeyoshi ; Yamaguchi, Masahiro

  • Author_Institution
    NEC TOKIN Corp., Sendai, Japan
  • Volume
    45
  • Issue
    10
  • fYear
    2009
  • Firstpage
    4250
  • Lastpage
    4252
  • Abstract
    A lead frame in a large-scale integration (LSI) package, which should be a path of electromagnetic noise conduction, was coated with ferrite-plated films in order to suppress the electromagnetic interference (EMI) found inside recent electronic devices. A lead frame with 80 pins and a pin pitch of 0.65 mm was mounted on a rotating table, onto which a reaction solution of FeCl2 + NiCl 2 +ZnCl2 and an oxidizing solution of NaNO 2 +CH3COONH4 were simultaneously sprayed at 90 degC. The ferrite film on every surface of the lead frame had nearly the same thickness of around 3 mum with a definite columnar structure aligned perpendicular to the film plane. This suggested that the aqueous solution sprayed on the top surface of each pin flowed down to reach not only the lateral sides but also the back side under the optimum plating condition. Noise suppression effects of the ferrite films were predicted using an electromagnetic field simulation. In order to examine the influence of permeability on the noise suppression effect, the measured permeability spectra of films A (Ni 0.2Zn0.6Fe2.2 O4) and B (Ni0.2 Zn 0.3Fe2.5O4 ) with natural resonance frequencies (f r s) around 0.05 and 0.35 GHz, respectively, were employed for the calculation. The calculated loss power ratio P loss/P in of the ferrite films exhibited similar frequency dependences to those of the product of the measured imaginary permeability mu ´´ and the frequency f(mu´´ x f) for both films. The loss power ratio P loss/P in for Film B, which had a higher f r, was higher than that for Film A above and around the cross point of their mu´´ x f. This indicated that - - magnetic loss was the predominant factor in P loss/P in. For Film B, P loss/P in was almost the same as that without ferrite films around 0.1 GHz, where P loss/P in began to rise. This meant that the insertion loss was negligibly small. In addition, the harmful effect of the ferrite films on signal transmission due to an increase of reflection parameter S 11 was weak enough for both films. The simulation results described above suggested that the lead frame equipped with a low-pass filter having an intended cut-off frequency can be obtained by changing the permeability spectrum, i.e., chemical composition of the ferrite film.
  • Keywords
    electromagnetic interference; ferrites; interference suppression; large scale integration; lead; magnetic leakage; nickel compounds; permeability; zinc compounds; LSI packages; Ni0.2Zn0.3Fe2.5O4-Pb; Ni0.2Zn0.6Fe2.2O4-Pb; electromagnetic interference; electromagnetic noise conduction; electromagnetic noise suppression; ferrite film-plated lead frame; insertion loss; large-scale integration; loss power ratio; magnetic loss; permeability; reflection parameter; Complex permeability; electromagnetic interference; ferrite-plated film; lead frame;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2009.2023872
  • Filename
    5257010