DocumentCode :
1449382
Title :
Design and Implementation of Block-Based Partitioning for Parallel Flip-Chip Power-Grid Analysis
Author :
Wei, Chun-Jen ; Chen, Howard ; Chen, Sao-Jie
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Volume :
31
Issue :
3
fYear :
2012
fDate :
3/1/2012 12:00:00 AM
Firstpage :
370
Lastpage :
379
Abstract :
Power-grid analysis is one of the critical design steps to ensure circuit reliability and achieve performance targets for very large scale integration systems. With each new technology generation, the circuit size has decreased and the power density has increased. Consequently, power-grid analysis has become ever more complex with greater CPU runtime and memory usage requirements. For a state-of-the-art power-grid design with more than 100-million nodes, it is often desirable to partition the power grid into smaller regions and analyze them in parallel by exploiting the locality of flip-chip packages. However, the traditional area-based partitioning strategy may not be best suited to analyze the DC current and ohmic IR voltage drop of a design that has irregular power rails and nonuniform power consumption because such nonuniformity affects the locality of power supply network and the accuracy of analysis. In this paper, we will present the analysis of a flip-chip design with 136-million nodes and propose a block-based partitioning scheme to improve the accuracy of parallel power-grid analysis.
Keywords :
VLSI; flip-chip devices; integrated circuit design; integrated circuit packaging; integrated circuit reliability; CPU runtime; block-based partitioning; circuit reliability; memory usage; ohmic IR voltage drop; parallel flip-chip power-grid analysis; power density; power rails; power-grid design; very large scale integration systems; Accuracy; Partitioning algorithms; Power demand; Power grids; Rails; Resistance; Locality; parallel computation; partitioning; power distribution network; power grid;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2011.2173489
Filename :
6152783
Link To Document :
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