Title :
WR1.5 Silicon Micromachined Waveguide Components and Active Circuit Integration Methodology
Author :
Leong, Kevin M K H ; Hennig, Kelly ; Zhang, Chunbo ; Elmadjian, Raffi N. ; Zhou, Zeyang ; Gorospe, Ben S. ; Chang-Chien, Patty P. ; Radisic, Vesna ; Deal, William R.
Author_Institution :
Northrop Grumman Aerosp. Syst., Redondo Beach, CA, USA
fDate :
4/1/2012 12:00:00 AM
Abstract :
This paper describes the development of silicon micromachined waveguide structures operating in the WR1.5 waveguide band (500-750 GHz). Average waveguide loss of 0.15 dB/mm was measured at 600 GHz. Capabilities of the proposed approach have been shown with the development of a 570-GHz three-pole waveguide bandpass filter that has a 0.9-dB passband loss and a Y-junction coupler operating at 670 GHz. These components have been tested using a novel on-wafer testing method for rapid characterization throughput. A batch process approach for integration of solid-state devices and micromachined waveguide components has also been developed. Further development of this technology will lead to the next generation of terahertz-frequency wafer-level packaging of active circuits.
Keywords :
active networks; band-pass filters; elemental semiconductors; losses; micromechanical devices; silicon; terahertz wave devices; wafer level packaging; waveguide couplers; waveguide filters; WR1.5 silicon micromachined waveguide components; WR1.5 waveguide band; Y-junction coupler; active circuit integration methodology; average waveguide loss; batch process approach; frequency 570 GHz; frequency 600 GHz; frequency 670 GHz; on-wafer testing method; passband loss; rapid characterization throughput; solid-state devices; terahertz-frequency wafer-level packaging; three-pole waveguide bandpass filter; Couplers; Loss measurement; Probes; Semiconductor device measurement; Silicon; Surface waves; Waveguide components; $E$-plane probe transition; silicon (Si) micromachining; terahertz circuits; waveguide coupler; waveguide filter;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2012.2184296