Title :
An Efficient Linearization Scheme for a Digital Polar EDGE Transmitter
Author :
Mehta, Jaimin ; Zoicas, Vasile ; Eliezer, Oren ; Staszewski, R. Bogdan ; Rezeq, Sameh ; Entezari, Mitch ; Balsara, Poras
Author_Institution :
Xtendwave Inc., Dallas, TX, USA
fDate :
3/1/2010 12:00:00 AM
Abstract :
A new linearization scheme is proposed, which compensates for nonlinear distortions experienced in the amplitude-modulation path of a digital polar EDGE transmitter integrated in a 65-nm CMOS transceiver system-on-chip (SoC) based on the Digital RF Processor (DRP) technology. The measured amplitude and phase distortions are stored in lookup tables and used for predistortion without requiring inversion computations, thus achieving significant complexity reduction. Adaptive linear interpolation along with adaptive resolution enhancement provides the desired performance across power levels. With the presented scheme, the transmitter´s measured performance significantly exceeds the EDGE specifications with an error vector magnitude (EVM) of typically 3% and a close-in modulated spectrum of -64 dB at a 400-kHz offset from the carrier frequency.
Keywords :
3G mobile communication; CMOS integrated circuits; amplitude modulation; intermodulation distortion; interpolation; linearisation techniques; radio transmitters; system-on-chip; transceivers; CMOS transceiver system-on-chip; Digital RF Processor technology; adaptive linear interpolation; adaptive resolution enhancement; amplitude-modulation path nonlinear distortions; digital polar EDGE transmitter; error vector magnitude; linearization scheme; lookup tables; phase distortions; CMOS process; CMOS technology; Distortion measurement; Nonlinear distortion; Phase distortion; Phase measurement; Radio frequency; System-on-a-chip; Transceivers; Transmitters; All-digital transmitter; Digital RF Processor (DRP); EDGE; calibration; linearization; polar transmitter; power amplifier (PA); predistortion; system-on-chip (SoC);
Journal_Title :
Circuits and Systems II: Express Briefs, IEEE Transactions on
DOI :
10.1109/TCSII.2010.2041811