DocumentCode :
1450391
Title :
Planar integration of a resonant-tunneling diode with pHEMT using a novel proton implantation technique
Author :
Chen, C.L. ; Mahoney, L.J. ; Calawa, S.D. ; Mathews, R.H. ; Molvar, K.M. ; Sage, J.P. ; Maki, P.A. ; Sollner, T.C.L.G.
Author_Institution :
Lincoln Lab., MIT, Lexington, MA, USA
Volume :
19
Issue :
12
fYear :
1998
Firstpage :
478
Lastpage :
480
Abstract :
A novel technique of integrating resonant-tunneling diodes (RTDs) with pseudomorphic high-electron-mobility transistors (pHEMTs) is demonstrated. A proton was implanted through the pHEMT layers to convert the RTD structure underneath to a high-resistivity buffer without degrading the performance of the pHEMT. The cutoff frequency is 16 GHz for a 1.5-μm-gate-length pHEMT on such an implanted buffer. Substituting the conventional deep mesa etch with ion implantation maintains a highly planar surface. Such a monolithically integrated RTD/pHEMT oscillator is described.
Keywords :
HEMT circuits; high electron mobility transistors; ion implantation; resonant tunnelling diodes; variable-frequency oscillators; 1.5 micron; 16 GHz; RTD/pHEMT oscillator; cutoff frequency; high-resistivity buffer; implanted buffer; ion implantation; pHEMT; planar surface; proton implantation technique; resonant-tunneling diode; Diodes; Etching; FETs; Fabrication; Gallium arsenide; Implants; Indium gallium arsenide; PHEMTs; Protons; Resonant tunneling devices;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.735752
Filename :
735752
Link To Document :
بازگشت