DocumentCode :
1450476
Title :
Comprehensive analysis of reverse short-channel effect in silicon MOSFETs from low-temperature operation
Author :
Szelag, B. ; Balestra, F. ; Ghibaudo, Gerard
Author_Institution :
Lab. de Phys. des Composants a Semicond., ENSERG, Grenoble, France
Volume :
19
Issue :
12
fYear :
1998
Firstpage :
511
Lastpage :
513
Abstract :
The reverse short channel effect (RSCE) is a major issue for deep-submicron CMOS technologies. In this paper, the RSCE is studied over a wide range of temperature (from 300 K down to 30 K). It is shown that the temperature lowering results in a significant reduction of the RSCE. Moreover, we show using these low temperature experiments that the RSCE arises from an excess doping concentration near the source and drain as supported from both analytical modeling and two-dimensional (2-D) numerical simulation.
Keywords :
MOSFET; cryogenic electronics; doping profiles; elemental semiconductors; semiconductor device models; silicon; 2D numerical simulation; 30 to 300 K; CMOSFETs; RSCE; Si MOSFET; analytical modeling; deep-submicron CMOS technologies; excess doping concentration; low-temperature operation; reverse short-channel effect; Analytical models; CMOS technology; Doping; MOSFET circuits; Numerical simulation; Semiconductor device modeling; Semiconductor process modeling; Silicon; Temperature distribution; Threshold voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.735763
Filename :
735763
Link To Document :
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