• DocumentCode
    1450721
  • Title

    Miniature Moisture Sensor Based on Ultracapacitor Technology

  • Author

    Bakhoum, Ezzat G. ; Cheng, Marvin H M

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of West Florida, Pensacola, FL, USA
  • Volume
    2
  • Issue
    7
  • fYear
    2012
  • fDate
    7/1/2012 12:00:00 AM
  • Firstpage
    1151
  • Lastpage
    1157
  • Abstract
    This paper introduces a new ultraminiature, ultrahigh sensitivity moisture sensor that is based on ultracapacitor technology. An ultracapacitor is assembled from ordinary activated carbon electrodes, however, unlike ordinary ultracapacitors, no liquid electrolyte exists inside the device. The ultracapacitor electrodes are placed on both sides of a layer of porous silicon in which potassium hydroxide in powder form is embedded. As moisture penetrates the porous silicon layer, a liquid electrolyte starts to form. The conductivity of the electrolyte, and hence the capacitance of the ultracapacitor assembly, increase as the amount of moisture increases. In the present prototype, an increase in the relative humidity from 5% to 80% results in a capacitance variation from 0 to 17 μF. The sensor can be very useful for monitoring moisture penetration inside small electronic devices and packages that are sensitive to moisture.
  • Keywords
    capacitive sensors; electrochemical electrodes; electrolytes; humidity sensors; potassium compounds; powders; supercapacitors; KOH; Si; capacitance 0 muF to 17 muF; carbon electrode; electronic device packaging; liquid electrolyte conductivity; moisture penetration monitoring; porous silicon layer; powder form; ultracapacitor assembly; ultracapacitor electrode technology; ultraminiature ultrahigh sensitivity capaciitive moisture sensor; Capacitance; Humidity; Moisture; Silicon; Slabs; Supercapacitors; Temperature measurement; Capacitive moisture sensor; moisture sensor; moisture sensor with ultracapacitor structure;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2012.2185496
  • Filename
    6153354