• DocumentCode
    1450975
  • Title

    Using the Sherman-Morrison-Woodbury Formula for Coupling External Circuits With FEM for Simulation of Eddy Current Problems

  • Author

    White, Daniel A.

  • Author_Institution
    Lawrence Livermore Nat. Lab., Livermore, CA, USA
  • Volume
    45
  • Issue
    10
  • fYear
    2009
  • Firstpage
    3915
  • Lastpage
    3918
  • Abstract
    Simulation of three-dimensional transient eddy current problems is important to numerous applications. The Finite Element Method (FEM) has proven be to be powerful numerical technique for solving the Partial Differential Equations (PDE) describing eddy currents. In order to solve the PDE, boundary conditions must be provided, and in many applications the boundary conditions are not known explicitly but can be provided by a Resistor-Inductor-Capacitor (RLC) circuit model. The emphasis of this paper is on an efficient and exact coupling of the RLC network equations with the FEM equations. The coupling is based on an exact linear algebra identity known as the Sherman-Morrison-Woodbury (SMW) formula. One advantage of this approach is that the FEM matrices are not modified. This is important if a fast ldquoblack-boxrdquo solver is available for the FEM matrices, these solvers typically require that the matrices have certain mathematical properties and these properties are not modified by the SMW approach. A second advantage is that the SMW approach is valid for an arbitrary number of independent external circuits.
  • Keywords
    RLC circuits; coupled circuits; eddy currents; finite element analysis; matrix algebra; partial differential equations; FEM; PDE; RLC network; Sherman-Morrison-Woodbury formula; black-box solver; boundary conditions; exact linear algebra; external circuits; finite element method; partial differential equations; resistor-inductor-capacitor circuit model; three-dimensional transient eddy current problems; Circuits; eddy currents; finite element; pulse power;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2009.2022274
  • Filename
    5257278